Power Device Packaging

High-Performance Power Semiconductor Packages

Complete Power Packaging Solutions for Automotive, Industrial and Energy Applications

CG Semi's power packaging portfolio includes advanced solutions designed to meet the demanding requirements of high-power semiconductor devices. Our portfolio features Power QFN and TO type packages, offering excellent thermal performance, high current carrying capability, and robust mechanical reliability for a wide range of power applications.

These packages serve applications such as power management ICs, motor drives, and DC-DC converters, leveraging power semiconductor technologies such as Silicon, Silicon Carbide, Gallium Nitride, and IGBTs. Designed for efficient heat dissipation and low electrical parasitics, CG Semi's power packages enable high-efficiency power conversion in automotive, industrial automation, renewable energy, consumer electronics, telecommunications, data centers, and e-Mobility applications.

Leveraging advanced manufacturing processes, automated assembly, and comprehensive reliability qualification, CG Semi delivers scalable, high-quality power packaging solutions that meet the evolving needs of next-generation power electronics. Our flexible package designs and manufacturing capabilities support both standard and customized solutions, enabling customers to accelerate product development while ensuring long-term reliability and high-volume production.