SOP is a leadframe-based, plastic-encapsulated surface-mount semiconductor package designed for compact, high-density PCB assembly. These industry-standard packages yield a significant reduction in size while running in high volume and provide value-added, low-cost solutions for a wide range of applications. SOP packages are well suited for miniaturization and high-density electronic applications.
SOP packages are designed to be compact and thin, allowing for efficient use of space on printed circuit boards (PCBs).
Excellent thermal dissipation capabilities
SOP packages offer good electrical performance due to their short lead lengths, reduced parasitic effects, and optimized electrical characteristics
Parameter
Specification
Package Size
3.9x4.9 mm to 15.9x28.5 mm
Die Size
1x1 mm to 10x10 mm
Wire Diameter
1.0 mil or 1.3 mil
Wafer Thickness
>100 µm
Leadframe Thickness
120-250 µm
Package Thickness
1.2 to 2.7 mm
