Laminate Packaging

High-Performance Laminate Semiconductor Packages

Complete Laminate Packaging Solutions for High-Performance Applications

CG Semi's laminate packaging portfolio includes advanced substrate-based packaging solutions designed to meet the performance, miniaturization, and reliability requirements of today's high-density semiconductor devices. Our portfolio features BGA, FCCSP, FCBGA, and SiP technologies, delivering excellent electrical performance, superior thermal management, and high interconnection density for a broad range of applications.

These package solutions support a wide variety of semiconductor devices, including application processors, microcontrollers, AI and HPC processors, memory devices, RF and wireless ICs, networking devices, power management ICs, sensors, and mixed-signal devices. With fine-pitch interconnects, high I/O capability, advanced substrate technology, and optimized thermal performance, CG Semi's laminate packages enable high-speed signal transmission, increased functionality, and compact system integration for automotive, consumer electronics, industrial automation, telecommunications, networking, data centers, medical devices, and IoT applications.

Leveraging advanced manufacturing processes, automated assembly, and comprehensive reliability qualification, CG Semi delivers scalable, high-quality laminate packaging solutions that meet the evolving demands of next-generation semiconductor devices. Our flexible package designs and manufacturing capabilities support both standard and customized solutions, enabling customers to accelerate product development while ensuring exceptional quality, long-term reliability, and high-volume production.