Quad Flat Package is a surface-mount IC package with gull-wing leads on all four sides, designed to provide high pin counts and reliable electrical connections for a wide range of electronic applications.
High lead count for complex ICs Easy visual inspection of solder joints
Good mechanical reliability Cost-effective packaging solution Compatible with standard SMT assembly
Easy rework and repair due to gull-wing leads Suitable for fine-pitch and high-density designs
Parameter
Specification
Package Size
5x5 mm to 40x40 mm
Die Size
2x2 mm to 20x20 mm
Wire Diameter
0.7 mil - 2 mil
Wafer Thickness
>100 µm
Leadframe Thickness
100-300 µm
Package Thickness
1.0 to 4.5 mm
