SOIC is a leadframe-based, plastic-encapsulated surface-mount package featuring gull-wing leads extending from both sides of the package. This industry-standard package supports high-volume, low-cost manufacturing while delivering proven mechanical and electrical reliability.
Small footprint reduces PCB size, enabling higher component density and more compact electronic products.
Leadframe-based, high-volume package that minimizes material usage and lowers overall packaging and assembly costs.
Gull-wing leads enable automated SMT assembly, easy inspection and rework, and reliable solder joints for high manufacturing yields.
Parameter
Specification
Package Size
3.9x4.9 mm to 15.4x31 mm
Die Size
1x1 mm to 8x8 mm
Wire Diameter
1.0 mil or 1.3 mil
Wafer Thickness
>100 µm
Leadframe Thickness
120-125 µm
Package Thickness
1.35 to 2.65 mm
