Operations & Quality
Senior Process Engineer
About the Role
Provide technical leadership for next-generation packaging architectures, process transfers, and mentor junior process engineers on cutting-edge OSAT lines.
Responsibilities
- Lead technical qualification of new packaging materials, epoxy mold compounds, and solder alloys.
- Interface with global customers and Tier-1 automotive clients on technical requirements.
- Drive zero-defect culture and advanced statistical process control across all assembly modules.
Qualifications
- B.Tech / M.Tech / Ph.D in Electronics or Materials Engineering.
- 5+ years (or 2-5 intensive years with advanced degree) in semiconductor packaging.
- Proven track record of taking products from NPI (New Product Introduction) to high volume.